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Illustrated Changes to the NEC, 2002 Edition - Part 1

Article 250

General

250.4 General Requirements for Grounding and Bonding

Section 250-2 in the 1999 NEC was revised and relocated to 250.4. It now reads:

(A) Grounded Systems.

(4) Bonding of Electrically Conductive Materials and Other Equipment.
Electrically conductive materials that are likely to become energized must be connected together and to the grounded (neutral) terminal at the electrical supply source in a manner that establishes an effective ground-fault current path. Figure 250–6


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